Trüb introduced the new CombOS^® DI (Dual Interface) for contactless and contact-based EMV compliant smart card solutions. The second generation is based on the new specifications from MasterCard and Visa and offers an increased transaction speed, new functionalities such as ‘data storage’ and improved security. CombOS^® is the portfolio of chip operating systems developed by Trüb for EMV compliant smart card solutions combining payment and access. 

The portfolio of CombOS^® EMV compliant operating systems is continually being developed and is based on the new specifications from MasterCard – M/Chip Advance – and from Visa – VSDC v1.5.3 and VCPS 2.1.1. 

Payment transactions with CombOS^® DI v2 are significantly faster: contactless transactions with PayPass M/Chip and payWave VSDC will be 30% quicker than with the predecessor product, PayPass Magstripe and payWave MSD transactions are 20% faster. CombOS DI v2 also allows for backward compatibility with M/Chip 4 as well as M/Chip 2 allowing implementation all over the world. 

Trüb now gives issuers the opportunity to combine payment with other disciplines. There are now three alternatives on offer: the new MasterCard Data Storage, a MiFare emulation or standard ISO commands. Issuers may use these capabilities in transport, loyalty, authentication and physical access projects. Contact Trüb to find out how these alternatives may benefit customers in complex tasks. 

With the new generation of CombOS^® DI customers will benefit from increased security thanks to the use of the new Infineon SLE78 chip with Integrity Guard^®. The new CombOS^® DI will be available starting from September 2012.